Direct-to-chip cooling
Assess cold plate interfaces, coolant compatibility, heat load and serviceability.
AI INFRASTRUCTURE
Built for the heat of AI.
Plan high-density compute around the infrastructure it needs: liquid cooling, thermal visibility and serviceable system design.
LIQUID-COOLED COMPUTE
+ AUTONOMOUS OPERATIONS
REFERENCE ARCHITECTURE / 01
THERMAL DESIGN AS A SYSTEM
More than a cooling component.
Evaluate the complete heat path—from compute to facility rejection. System selection depends on workload, existing infrastructure and operating constraints.
Cooling distribution
Plan CDU sizing, hydraulic boundaries, redundancy and facility integration.
Immersion evaluation
Compare workload, hardware compatibility and maintenance requirements before selection.
Thermal monitoring
Align telemetry, leak detection and alarms with facility operating procedures.
Final thermal performance, capacity and efficiency depend on engineered system design and validated site conditions.
BEYOND THERMAL MANAGEMENT
Connect the facility.
Combine cooling telemetry with inspection robotics and AI-assisted monitoring.
START WITH THE RIGHT QUESTIONS
Your next operation
starts here.
Identify the use case. Understand the constraints. Build the right solution.